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IEC 60191-1-2018 pdf free

IEC 60191-1-2018 pdf free.Mechanical standardization of semiconductor devices – Part 1: General rules for the preparation of outline drawings of discrete devices.
Complete interchangeability involves other considerations such as the electrical and thermal characteristics of the semiconductor devices concerned.
The international standardization represented by these drawings therefore encourages the manufacturers of devices to comply with the tolerances shown on the drawings in order to extend their range of customers internationally. It also gives equipment designers an assurance of mechanical interchangeability between the devices obtained from suppliers in different countries, provided they allow the space in their equipment that is indicated by the drawings and take note of the more precise information on bases, studs. etc.
NOTE Additional details of reference letter symbols used in this document are given in Annex A.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
IEC 60191-2, Mechanical standardization of semiconductor devices — Part 2: Dimensions
IEC 60191-4, Mechanical standardization of semiconductor devices — Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-6-1, Mechanical standardization of semiconductor devices — Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages — Design guide for gull-wing lead terminals
IEC 60191-6-3, Mechanical standardization of semiconductor devices — Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages — Measuring methods for package dimensions of quad flat packs (QFP)
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and lEG maintain terminological databases for use in standardization at the following addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1 device outline drawing
drawing that includes all dimensional characteristics required for the mechanical interchangeability of the complete device
Note 1 to entry: The device outline drawing includes the case or body, all terminals and the locating tab if present.
3.2 terminal part of the semiconductor device primarily used in making an electrical, mechanical or thermal connection.IEC 60191-1 pdf free download.

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