IEC 61760-3-2021 pdf free

IEC 61760-3-2021 pdf free.Surface mounting technology – Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering.
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194-1 and the following apply.
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4 Requirements to component design and component specifications
4.1 General requirement
The component specification for THR components (hereinafter, referred to as component specification) shall specify the requirements specified in 4.2 through 4.9 and Clause 6.
4.2 Packaging
Packaging for THR components shall be in accordance with IEC 60286-3, IEC 60286-4 and IEC 60286-5.
The component specification shall specify the following:
— Protection of THR components during transportation and storage;
— Moisture absorption control: if needed, follow the moisture sensitivity level (MSL) according to IEC 61760-4, IEC 60749-20 or IPC/JEDEC J-STD-020 (see 6.7);
— Polarity or pin I indication (see Figure 1);
— Orientation of the component in the packaging (see Figure 2).
4.3 Labelling of component packaging
Labelling of the component packaging should comply with lEG 62090.
NOTE The following items are particularly important.
— item identification (e.g. customer part number or manufacturer part number or both):
— quantity:
— traceability identification (e.g. batch number or serial number).
4.4 Component marking
The marking on the component shall be specified in the component specification.
4.5 Storage and transportation
Component specification shall refer to storage and transportation conditions of IEC 61760-2.
4.6 Component outline and design
4.6.1 Drawing and specification
Drawings, including bottom-view, top-view and side-view drawings, of the component showing all dimensions and tolerances of its body and terminals shall be part of the component specification. The drawing shall include reference to the positioning of the component body and terminals on the mounting land pattern. If conductive surfaces are not planar, their three- dimensional geometry shall be clearly specified with the relevant tolerances.
In any 2D drawing or 3D data, conductive parts/surfaces and insulating parts/surfaces shall be clearly distinguished, at least for bottom and sides of components, as well as for movable parts. This requirement applies both to the disassembled and the assembled condition for parts requiring a final assembly step after mounting on a substrate (e.g. if a connector contains spring-loaded retainers, which change their position/angle upon mating). The locations and dimensions of conductive parts/surfaces shall be specified even if they are not intended for establishing a contact with the mounting surface, e.g. punched or sawn surfaces consisting of unplated leadframe resulting from component singulation for molded semiconductor packages.IEC 61760-3 pdf free download.